The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2026

Filed:

Dec. 17, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Ronald L. Spreitzer, Phoenix, AZ (US);

Ankur Agrawal, Chandler, AZ (US);

Guiyun Bai, Chandler, AZ (US);

Eleanor Patricia Paras Rabadam, Folsom, CA (US);

Sanjeev Gupta, Santa Rosa, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); G01S 7/481 (2006.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); G01S 7/481 (2013.01); H01L 24/17 (2013.01); H01L 25/0756 (2013.01); H01L 2924/12042 (2013.01);
Abstract

Various embodiments disclosed relate to semiconductor packaging for photonic modules in LiDAR systems. The present disclosure includes semiconductor assemblies using an organic substrate interposer surface mounted to the printed circuit board, with an electronic integrated circuit die attached to the organic substrate and a photonic integrated circuit die attached to the organic substrate, wherein the electronic integrated circuit die, and the photonic integrated circuit die are electrically coupled to each other through the organic substrate interposer.


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