The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2026
Filed:
Mar. 01, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes a first redistribution structure, a first die above the first redistribution structure, a second die above the first die, a heat dissipation unit on side surfaces of the first die or the second die, and a second redistribution structure above the second die. The semiconductor package includes a first post protruding from an upper surface of the first redistribution structure and extending to a lower surface of the second redistribution structure, a second post connecting the heat dissipation unit with a heat dissipation redistribution structure as a thermal path, and a molding unit filling an empty space between the first redistribution structure and the second redistribution structure. An outer pad of the heat dissipation redistribution structure is exposed to an outside of the semiconductor package, and an inner pad of the heat dissipation redistribution structure is in contact with the second post.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile