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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12579637 B1

PDFFull Text
Date of Patent:
Mar. 17, 2026

Filed:

Mar. 21, 2023

Creating scanning plans for improving accuracy and resolution of optical wafer inspection

Applicant:

Synopsys, Inc., Mountain View, CA (US);

Inventors:

Ankush Bharati Oberai, Fremont, CA (US);

Rajesh Ramesh Sahani, Mumbai, IN;

Shivraj Bhagwat Patil, Mumbai, IN;

Assignee:

SYNOPSYS, INC., Sunnyvale, CA (US);

Attorneys:

Laxman Sahasrabuddhe

Park, Vaughan, Fleming & Dowler LLP

Primary Examiner:

Samir A Ahmed

Int. Cl.
CPC ...
G06T 7/00 (2017.01); G01N 21/95 (2006.01); G06T 7/70 (2017.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G01N 21/9505 (2013.01); G06T 7/70 (2017.01); G06T 2207/30148 (2013.01);
Abstract

A circuit design may be partitioned into a set of regions. Regions in the set of regions that are substantially identical to one another may be identified and overlaps between the set of regions may be determined. A scanning plan may be created based on the set of regions, the regions in the set of regions that are substantially identical to one another, and the overlaps between the set of regions. The scanning plan may be provided to an OWI system which inspects a set of dies fabricated based on the circuit design. A scan result may be received from the OWI system based on inspecting a die in the set of dies. A defect location in the die may be identified based on the scan result and the scanning plan.

Find Patent Forward Citations

Oberai, Ankush. (2026). Creating scanning plans for improving accuracy and resolution of optical wafer inspection (U.S. Patent No. 12579637). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12579637

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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