The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2026
Filed:
Dec. 12, 2023
Intel Corporation, Santa Clara, CA (US);
Sridhar Muthrasanallur, Bengaluru, IN;
Debendra Das Sharma, Saratoga, CA (US);
Swadesh Choudhary, Mountain View, CA (US);
Gerald Pasdast, San Jose, CA (US);
Peter Onufryk, Flanders, NJ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Technologies for a unified debug and test architecture in chiplets is disclosed. In an illustrative embodiment, several chiplets are integrated on an integrated circuit package. The chiplets are connected by a package interconnect, such as a universal chiplet interconnect express (UCIe) interconnect. Each chiplet includes several debug nodes, which are connected by an on-chiplet network. One of the chiplets, referred to as a package debug endpoint, acts as a link endpoint for an off-package link, such as a peripheral component interconnect express (PCIe) link. In use, debug messages can be sent to the package debug endpoint over a PCIe link. The debug messages can be routed within the chiplets and between chiplets, allowing for the debug functionality at each debug node to be probed using a common protocol. In this manner, chiplets from different vendors can be integrated into the same package and tested using common software.