Device, method and system to sense voltages at sample points of respective interconnect structures

Abstract

Techniques and mechanisms for sensing a voltage difference across two interconnect structures of a multi-chip packaged device. In an embodiment, the interconnect structures provide respective voltages to each of multiple integrated circuit (IC) chips of the packaged device. Switch circuitry of the packaged device is operable to provide any of multiple modes which each switchedly couple a voltage sensor to a different respective one of various sample point pairs of the interconnect structures. Control circuitry operates the switch circuitry to selectively provide one of the multiple modes based on an indication of a workload to be performed with one or more of the IC chips. In another embodiment, the voltage sensor senses the voltages each at a respective sample point of a sample point pair which corresponds to the selected mode of the switch circuitry.