The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

May. 20, 2021
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventor:

Taro Nishiguchi, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H10D 62/832 (2025.01);
U.S. Cl.
CPC ...
H01L 21/02378 (2013.01); H01L 21/02447 (2013.01); H01L 21/02529 (2013.01); H01L 21/02576 (2013.01); H01L 21/02609 (2013.01); H01L 21/0262 (2013.01); H01L 21/02658 (2013.01); H10D 62/8325 (2025.01);
Abstract

A silicon carbide epitaxial substrate according to the present disclosure includes: a silicon carbide substrate; a first silicon carbide epitaxial layer disposed on the silicon carbide substrate; and a second silicon carbide epitaxial layer disposed on the first silicon carbide epitaxial layer. When an area density of first particles in the first silicon carbide epitaxial layer is defined as a first area density and an area density of second particles in the second silicon carbide epitaxial layer is defined as a second area density, a value determined by dividing the first area density by the second area density is more than 0.5 and less than 1. The first particles and the second particles each have a maximum diameter of 2 μm to 50 μm.


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