The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Aug. 05, 2024
Tong Hsing Electronic Industries, Ltd., Taoyuan City, TW;
Yu-Hsiang Liu, Taoyuan City, TW;
Li-Chun Hung, Taoyuan City, TW;
TONG HSING ELECTRONIC INDUSTRIES, LTD., Taoyuan City, TW;
Abstract
A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a sensor chip mounted on the substrate, a ring-shaped supporting layer disposed on the sensor chip, a light-permeable sheet disposed on the ring-shaped supporting layer, and an encapsulant formed on the substrate. The top portion of the light-permeable sheet has an avoidance slot formed on an outer edge thereof. The encapsulant is formed by a solidified liquid compound and is not located in the avoidance slot. The encapsulant includes an adhesive and a plurality of fillers mixed in the adhesive. The encapsulant has a filler settling boundary through the precipitation of the fillers. The inner edge of the filler settling boundary is not in contact with the light-permeable sheet and surrounds at an outer side of the avoidance slot.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile