The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Feb. 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Hengyuan Lee, Hsinchu County, TW;
Xinyu Bao, Fremont, CA (US);
Taiwan Semiconductor Manufacturing Company. Ltd., Hsinchu, TW;
Abstract
A semiconductor device includes a first conductive line, a second conductive line, a third conductive line, a first semiconductor layer, a memory layer and a conductive layer. The first conductive line and the second conductive line extend along a first direction. The third conductive line extends along a second direction substantially perpendicular to the first direction. The first semiconductor layer extends along the second direction to surround the third conductive line. The memory layer is disposed between the first semiconductor layer and the second conductive line. The conductive layer is disposed between the memory layer and the first semiconductor layer.