The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Aug. 08, 2023
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventor:

Makoto Kato, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); H01J 37/32082 (2013.01); H01J 37/3244 (2013.01); H01J 37/32568 (2013.01); H01J 37/32642 (2013.01); H01L 21/6833 (2013.01);
Abstract

A plasma processing apparatus includes a plasma processing chamber and a substrate support disposed in the plasma processing chamber. The substrate support includes a ceramic member having a substrate supporting surface and a back surface, a chuck electrode layer, a bias electrode layer, a gas diffusion channel horizontally extending in the ceramic member and having a main path and branch paths branched from the main path, a gas inlet vertically extending from the back surface to the gas diffusion channel in the ceramic member, and gas outlets communicating with the gas diffusion channel. Each gas outlet has a cavity portion horizontally extending from at least one of the branch paths and a porous portion vertically extending from the cavity portion to the substrate supporting surface and filled with a ceramic porous material.


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Kato, Makoto. (2026). Plasma processing apparatus and electrostatic chuck (U.S. Patent No. 12573597). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12573597

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