The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Apr. 29, 2021
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Narimi Hosoda, Annaka, JP;
Toko Takahashi, Takasaki, JP;
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Abstract
A high thermal conductive silicone composition including: (A) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups in one molecule and a kinematic viscosity at 25 C of 100 to 100,000 mm/s; (B) an aluminum powder having an average particle size of 50 μm or more; (C) a thermal conductive filler having an average particle size of 0.1 to less than 50 μm; (D) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to a silicon atom (Si—H groups) in one molecule; (E) a hydrolyzable organopolysiloxane represented by the following general formula (1); and (F) a platinum group metal catalyst having an effective amount. The high thermal conductive silicone composition can conform to the warpage of a substrate due to an increased material thickness and can maintain heat dissipation performance due to a high thermal conductivity.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile