The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Jan. 07, 2022
Applicant:
Ekc Technology, Inc., Hayward, CA (US);
Inventors:
Assignee:
EKC TECHNOLOGY, INC., Hayward, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); C09K 13/04 (2006.01); C09K 13/06 (2006.01); G06F 3/041 (2006.01); G06F 3/044 (2006.01); H01L 21/302 (2006.01); H01L 21/304 (2006.01); H01L 21/308 (2006.01); H01L 21/311 (2006.01); H05K 1/02 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30604 (2013.01); C09K 13/04 (2013.01); C09K 13/06 (2013.01); G06F 3/04164 (2019.05); G06F 3/044 (2013.01); H01L 21/302 (2013.01); H01L 21/3043 (2013.01); H01L 21/306 (2013.01); H01L 21/308 (2013.01); H01L 21/3081 (2013.01); H01L 21/311 (2013.01); H01L 21/31144 (2013.01); H05K 1/0296 (2013.01); H05K 3/061 (2013.01); H05K 3/062 (2013.01); H05K 3/067 (2013.01); G06F 3/041 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04112 (2013.01); H05K 1/0274 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/026 (2013.01); H05K 2201/09681 (2013.01); H05K 2203/0548 (2013.01); H05K 2203/0789 (2013.01);
Abstract
A method is described for method for patterning a metal layer interfaced with a transparent conductive film, in which the method comprises contacting a structure through a patterned mask with an etching solution comprising Feions, wherein the structure comprises the metal layer comprising copper, nickel, aluminum or alloys thereof covering at least partially a transparent conductive film with conductive elements comprising silver, to expose a portion of the transparent conductive film. Etching solutions and the etched structures are also described.