The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Aug. 12, 2022
Renesas Electronics Corporation, Tokyo, JP;
Yasutaka Nakashiba, Tokyo, JP;
Hiroshi Miyaki, Tokyo, JP;
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Abstract
A semiconductor device includes a first semiconductor chip in which a first multilayer wiring structure including a first coil and a second coil is formed and a second semiconductor chip in which a second multilayer wiring structure including a third coil and a fourth coil is formed. The second semiconductor chip is joined to the first semiconductor chip such that the first coil (second coil) and the third coil (fourth coil) are overlapped and the second semiconductor chip does not have an offset structure with respect to the first semiconductor chip. The second semiconductor chip is joined to the first semiconductor chip such that it is not overlapped with a pad for the first semiconductor chip and a pad for the second semiconductor chip.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile