The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Jun. 29, 2022
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventor:
Xiang Li, Portland, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/26 (2006.01); H01R 12/75 (2011.01); H01R 13/40 (2006.01); H01R 4/02 (2006.01); H01R 12/53 (2011.01); H01R 13/03 (2006.01); H01R 13/50 (2006.01);
U.S. Cl.
CPC ...
H01R 13/26 (2013.01); H01R 12/75 (2013.01); H01R 13/40 (2013.01); H01R 4/023 (2013.01); H01R 12/53 (2013.01); H01R 13/03 (2013.01); H01R 13/50 (2013.01);
Abstract
Methods and apparatus relating to a high density cable structure and wire termination are described. In one embodiment, a plug structure includes a paddle card to couple two wires to two gold fingers and a first add-on plug to couple a first wire to a first gold finger. The paddle card and the first add-on plug are to be stacked to form a single plug structure having a first row of gold fingers and a second row of gold fingers. Other embodiments are also claimed and disclosed.
Li, Xiang. (2026). High density cable structure and wire termination (U.S. Patent No. 12567694). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12567694
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile