The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Sep. 29, 2023
Apple Inc., Cupertino, CA (US);
Behnam Ghassemiparvin, San Jose, CA (US);
Jingni Zhong, Santa Clara, CA (US);
Ming Chen, Cupertino, CA (US);
Bhaskara R Rupakula, San Jose, CA (US);
Yiren Wang, Cupertino, CA (US);
Han Wang, Campbell, CA (US);
Yuan Tao, Santa Clara, CA (US);
Victor C Lee, Santa Clara, CA (US);
Salih Yarga, San Jose, CA (US);
Erdinc Irci, Sunnyvale, CA (US);
Jennifer M Edwards, San Francisco, CA (US);
Hao Xu, Cupertino, CA (US);
Hongfei Hu, Cupertino, CA (US);
Carlo Di Nallo, Belmont, CA (US);
Mattia Pascolini, San Francisco, CA (US);
Apple Inc., Cupertino, CA (US);
Abstract
An electronic device may be provided with an antenna module having a substrate. An antenna may be disposed on the substrate. The antenna may have a directly fed patch and parasitic patches. The antenna may be fed by a feed via. The parasitic patches may include a first layer of parasitic patches separated by a gap overlapping the directly fed patch. The parasitic patches may include an additional parasitic patch formed in a second layer. The additional parasitic patch may overlap the gap. A floating ground via may couple a center of the additional parasitic patch and a center of the directly fed patch to a landing pad in a ground layer. The landing pad may short the via to the ground layer at the radiating frequency of the antenna. The landing pad may be electrically floating at DC frequencies.