The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Sep. 28, 2020
Versum Materials Us, Llc, Tempe, AZ (US);
Christopher David Fontana, Tempe, AZ (US);
David Carl Eshelman, Tempe, AZ (US);
Yusra Fatima, Tempe, AZ (US);
Thomas William Piltz, Tempe, AZ (US);
Mason Seidel, Tempe, AZ (US);
Versum Materials US, LLC, Tempe, AZ (US);
Abstract
A system for semiconductor fabrication having at least one heated valve manifold assembly comprising a heat-conductive plate having a total surface area, said conductive plate having a first side and a second side; at least one heater contacting said at least one heat-conductive plate; a valve manifold comprising a plurality of valves and pipes; said plurality of said valves and pipes having a total surface area wherein a portion of the surface area of said plurality of valves and pipes contacts said at least one heat-conductive plate; and one or more layers of insulation covering: (i) a majority of the surface area of said plurality of said valves and pipes where said portion contacts said at least one heat-conductive plate, (ii) said at least one heater in contact with said at least one heat-conductive plate, and (iii) the majority of the surface area of said at least one heat-conductive plate.