The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Apr. 28, 2023
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Venkatakaushik Voleti, San Jose, CA (US);

Kyle Tantiwong, Livermore, CA (US);

Mehdi Vaez-Iravani, Los Gatos, CA (US);

Assignee:

Applied Materials Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); H01L 21/67144 (2013.01); H01L 21/67288 (2013.01); H01L 24/80 (2013.01); H01L 2224/8001 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2224/80908 (2013.01);
Abstract

Methods and apparatus of hybrid bonding with inspection are provided herein. In some embodiments, a method of hybrid bonding with inspection includes: cleaning a substrate via a first cleaning chamber and a tape frame having a plurality of chiplets via a second cleaning chamber; inspecting, via a first metrology system, the substrate for pre-bond defects in a first metrology chamber and the tape frame for pre-bond defects in a second metrology chamber; bonding one or more of the plurality of chiplets to the substrate via a hybrid bonding process in a bonder chamber to form a bonded substrate; and performing, via a second metrology system different than the first metrology system, a post-bond inspection of the bonded substrate via a third metrology chamber for post-bond defects.


Find Patent Forward Citations

Voleti, Venkatakaushik. (2026). Integrated inspection for enhanced hybrid bonding yield in advanced semiconductor packaging manufacturing (U.S. Patent No. 12564015). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12564015

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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