The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Oct. 12, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Hsiu-Yu Kang, Taipei City, TW;

Hong-Wei Chen, Hsinchu City, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10D 64/01 (2025.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
H10D 64/021 (2025.01); H01L 21/02057 (2013.01); H01L 21/02126 (2013.01); H01L 21/0214 (2013.01); H01L 21/02211 (2013.01); H01L 21/02277 (2013.01); H01L 21/0228 (2013.01); H01L 21/02337 (2013.01); H01L 21/0234 (2013.01); H01L 21/3105 (2013.01); H10D 64/01 (2025.01); H10D 64/015 (2025.01); H10D 64/017 (2025.01);
Abstract

The present disclosure is directed to formation of a low-k spacer. For example, the present disclosure includes an exemplary method of forming the low-k spacer. The method includes depositing the low-k spacer and subsequently treating the low-k spacer with a plasma and/or a thermal anneal. The low-k spacer can be deposited on a structure protruding from the substrate. The plasma and/or thermal anneal treatment on the low-k spacer can reduce the etch rates of the spacer so that the spacer is etched less in subsequent etching or cleaning processes.


Find Patent Forward Citations

Quick Actions:

Kang, Hsiu-Yu. (2026). Method for forming a low-k spacer (U.S. Patent No. 12563806). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12563806

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