The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Apr. 20, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventors:

Jhih-Bin Chen, Hsinchu, TW;

Ming Chyi Liu, Hsinchu City, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10D 64/01 (2025.01); H10D 64/68 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01);
U.S. Cl.
CPC ...
H10D 64/017 (2025.01); H10D 64/691 (2025.01); H10D 84/014 (2025.01); H10D 84/0142 (2025.01); H10D 84/038 (2025.01);
Abstract

A semiconductor structure and forming method thereof are provided. The semiconductor structure includes a substrate, a gate dielectric, a gate electrode and dielectric structures. The gate dielectric has a top surface aligned with a top surface of the substrate. The gate electrode is disposed over the substrate and overlaps the gate dielectric. The gate electrode has first segments extending in parallel along a direction. The dielectric structures are disposed over the substrate, overlap the gate dielectric and extend in parallel along the direction. The dielectric structures and the first segments are arranged in an alternating pattern.


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