The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Aug. 11, 2022
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Yuta Nabuchi, Tokyo, JP;

Hiroshi Yanagigawa, Tokyo, JP;

Katsumi Eikyu, Tokyo, JP;

Atsushi Sakai, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/266 (2006.01); H10D 30/66 (2025.01); H10D 62/10 (2025.01);
U.S. Cl.
CPC ...
H10D 30/668 (2025.01); H01L 21/266 (2013.01); H10D 62/127 (2025.01);
Abstract

A semiconductor device and a method of manufacturing the same capable of ensuring a sufficient breakdown voltage near a terminal end portion of a cell portion are provided. The cell portion includes a first cell column region and a second cell column region adjacent to each other, and a first cell trench gate and a second cell trench gate arranged between the first cell column region and the second cell column region. An outer peripheral portion includes an outer peripheral trench gate connected to an end portion of each of the first cell trench gate and the second cell trench gate, and a first outer peripheral column region arranged on the cell portion side with respect to the outer peripheral trench gate and extended across the first cell trench gate and the second cell trench gate in plan view.


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