logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12563666 B1

PDFFull Text
Date of Patent:
Feb. 24, 2026

Filed:

Mar. 23, 2022

Metal sheet material, layered body, insulated circuit board, and metal sheet material manufacturing method

Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Marina Sakamaki, Saitama, JP;

Kenji Kubota, Naka, JP;

Toyo Ohashi, Saitama, JP;

Assignee:

MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;

Attorneys:

Troutman Pepper Locke LLP

James E. Armstrong, IV

Nicholas J. DiCeglie, Jr.

Primary Examiner:

Steven T Sawyer

Int. Cl.
CPC ...
H05K 1/09 (2006.01); B32B 3/30 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); C25D 3/38 (2006.01); C25D 5/00 (2006.01); C25D 5/18 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); B32B 3/30 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); C25D 3/38 (2013.01); C25D 5/18 (2013.01); C25D 5/605 (2020.08); C25D 5/617 (2020.08); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); B32B 2250/02 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2457/08 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32227 (2013.01); H01L 2924/014 (2013.01);
Abstract

This metal sheet material is made of copper or a copper alloy, and includes a main sheet body and a roughened plating layer that is formed on an outermost surface layer of the main sheet body. An engagement protrusion that protrudes toward the opposite side to the main sheet body and has a widening portion that gradually widens in width toward a tip end side in a protrusion direction is formed in the roughened plating layer. In a cross section of the main sheet body along the thickness direction, a plurality of the engagement protrusions are formed on a surface crystal grain that is located on the outermost surface of the main sheet body.

Find Patent Forward Citations

Sakamaki, Marina. (2026). Metal sheet material, layered body, insulated circuit board, and metal sheet material manufacturing method (U.S. Patent No. 12563666). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12563666

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…