The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Sep. 08, 2022
Applicant:

Honor Device Co., Ltd., Shenzhen, CN;

Inventors:

Puwei Bai, Shenzhen, CN;

Haojie Li, Shenzhen, CN;

Assignee:

Honor Device Co., Ltd., Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 1/181 (2026.01);
U.S. Cl.
CPC ...
H05K 1/0245 (2013.01); H05K 1/0218 (2013.01); H05K 1/0225 (2013.01); H05K 1/024 (2013.01); H05K 1/0253 (2013.01); H05K 1/18 (2013.01); H05K 1/181 (2013.01); H05K 2201/09254 (2013.01); H05K 2201/093 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10121 (2013.01);
Abstract

A circuit board and an electronic device is provided. The circuit board includes: a signal layer, where the signal layer includes at least one set of differential wires, and the at least one set of differential wires includes a first differential wire and a second differential wire that are insulated from each other; the first differential wire includes a first part, a second part, and a third part that are arranged successively in an extension direction of the first differential wire; and the second differential wire includes a fourth part, a fifth part, and a sixth part that are arranged successively in an extension direction of the second differential wire; and a ground plane, where the ground plane is disposed on at least one side of the signal layer, and is insulated from the signal layer; and the ground plane is provided with a first hollowed-out portion.


Find Patent Forward Citations

Quick Actions:

Bai, Puwei. (2026). Circuit board and electronic device (U.S. Patent No. 12563662). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12563662

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…