The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Feb. 01, 2024
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Koki Hidaka, Miyagi, JP;

Koichi Kazama, Miyagi, JP;

Takanori Sato, Miyagi, JP;

Miyu Shihommatsu, Miyagi, JP;

Takehiro Kato, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3244 (2013.01); H01J 37/32669 (2013.01); H01J 37/32091 (2013.01); H01J 2237/038 (2013.01);
Abstract

A plasma processing apparatus includes a plasma processing chamber; a substrate support; a lower electrode; an RF power supply; and an upper electrode assembly. The upper electrode assembly includes a gas diffusion plate; an insulating plate; and an upper electrode plate arranged between the gas diffusion plate and the insulating plate, and having a plurality of first through holes and a plurality of second through holes. The insulating plate includes an inner annular protrusion and an outer annular protrusion protruding downward from a lower surface of the insulating plate, and the insulating plate has a plurality of first gas introduction holes, a plurality of second gas introduction holes, and a plurality of third gas introduction holes.


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Hidaka, Koki. (2026). Plasma processing apparatus (U.S. Patent No. 12562344). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12562344

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