The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Apr. 17, 2023
Applicant:

Iowa State University Research Foundation, Inc., Ames, IA (US);

Inventors:

Martin Thuo, Ames, IA (US);

Ian Tevis, Ames, IA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 28/00 (2006.01); B22D 27/08 (2006.01); B22D 27/11 (2006.01); B22F 1/102 (2022.01); B22F 1/16 (2022.01); B22F 7/06 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); C22C 5/00 (2006.01); C22C 5/02 (2006.01); C22C 5/06 (2006.01); C22C 9/00 (2006.01); C22C 11/00 (2006.01); C22C 11/02 (2006.01); C22C 11/04 (2006.01); C22C 11/06 (2006.01); C22C 11/08 (2006.01); C22C 11/10 (2006.01); C22C 12/00 (2006.01); C22C 13/00 (2006.01); C22C 13/02 (2006.01); C22C 14/00 (2006.01); C22C 16/00 (2006.01); C22C 27/00 (2006.01); C22C 27/02 (2006.01); C22C 27/04 (2006.01); C22C 27/06 (2006.01); C22C 29/00 (2006.01); C22C 29/02 (2006.01); C22C 29/12 (2006.01); C22C 30/00 (2006.01); C22C 30/04 (2006.01); C22C 32/00 (2006.01);
U.S. Cl.
CPC ...
C22C 28/00 (2013.01); B22D 27/08 (2013.01); B22D 27/11 (2013.01); B22F 1/102 (2022.01); B22F 1/16 (2022.01); B22F 7/064 (2013.01); B23K 35/0244 (2013.01); B23K 35/262 (2013.01); B23K 35/264 (2013.01); B23K 35/3006 (2013.01); B23K 35/3013 (2013.01); B23K 35/3618 (2013.01); C22C 5/00 (2013.01); C22C 5/02 (2013.01); C22C 5/06 (2013.01); C22C 9/00 (2013.01); C22C 11/00 (2013.01); C22C 11/02 (2013.01); C22C 11/04 (2013.01); C22C 11/06 (2013.01); C22C 11/08 (2013.01); C22C 11/10 (2013.01); C22C 12/00 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); C22C 14/00 (2013.01); C22C 16/00 (2013.01); C22C 27/00 (2013.01); C22C 27/02 (2013.01); C22C 27/025 (2013.01); C22C 27/04 (2013.01); C22C 27/06 (2013.01); C22C 29/00 (2013.01); C22C 29/005 (2013.01); C22C 29/02 (2013.01); C22C 29/12 (2013.01); C22C 30/00 (2013.01); C22C 30/04 (2013.01); C22C 32/00 (2013.01); C22C 32/0005 (2013.01); C22C 32/001 (2013.01); C22C 32/0021 (2013.01); C22C 32/0026 (2013.01); C22C 32/0031 (2013.01); C22C 32/0042 (2013.01); C22C 32/0047 (2013.01); C22C 32/0052 (2013.01); C22C 32/0068 (2013.01);
Abstract

Undercooled liquid metallic core-shell particles, whose core is stable against solidification at ambient conditions, i.e. under near ambient temperature and pressure conditions, are used to join or repair metallic non-particulate components. The undercooled-shell particles in the form of nano-size or micro-size particles comprise an undercooled stable liquid metallic core encapsulated inside an outer shell, which can comprise an oxide or other stabilizer shell typically formed in-situ on the undercooled liquid metallic core. The shell is ruptured to release the liquid phase core material to join or repair a component(s).


Find Patent Forward Citations

Thuo, Martin. (2026). Stable undercooled metallic particles for filling a void (U.S. Patent No. 12559824). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12559824

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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