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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12558734 B1

PDFFull Text
Date of Patent:
Feb. 24, 2026

Filed:

Jul. 06, 2023

Multi-layer ceramic plate device

Applicant:

Watlow Electric Manufacturing Company, St. Louis, MO (US);

Inventors:

Michael Parker, Brentwood, CA (US);

Alfred Grant Elliot, Palo Alto, CA (US);

Brent Donald Alfred Elliot, Cupertino, CA (US);

Frank Balma, Los Gatos, CA (US);

Richard Erich Schuster, Milpitas, CA (US);

Dennis George Rex, Williams, OR (US);

Alexander Veytser, Mountain View, CA (US);

Assignee:

WATLOW ELECTRIC MANUFACTURING COMPANY, St. Louis, MO (US);

Attorney:

Burris Law, PLLC

Primary Examiner:

Kiley S Stoner

Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 1/19 (2006.01); B23K 1/20 (2006.01); B23K 35/00 (2006.01); B23K 35/28 (2006.01); B32B 3/30 (2006.01); B32B 7/14 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 15/20 (2006.01); B32B 18/00 (2006.01); C04B 35/645 (2006.01); C04B 37/00 (2006.01); F16B 9/00 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); H05B 1/00 (2006.01); B23K 103/10 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0008 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); B23K 1/20 (2013.01); B23K 35/005 (2013.01); B23K 35/286 (2013.01); B32B 3/30 (2013.01); B32B 7/14 (2013.01); B32B 9/005 (2013.01); B32B 9/04 (2013.01); B32B 9/041 (2013.01); B32B 15/20 (2013.01); B32B 18/00 (2013.01); C04B 35/645 (2013.01); C04B 37/001 (2013.01); C04B 37/006 (2013.01); F16B 9/00 (2013.01); H01L 21/67103 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01); H05B 1/00 (2013.01); B23K 2103/10 (2018.08); C04B 2235/6562 (2013.01); C04B 2235/6565 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/6581 (2013.01); C04B 2235/6582 (2013.01); C04B 2235/945 (2013.01); C04B 2237/121 (2013.01); C04B 2237/122 (2013.01); C04B 2237/126 (2013.01); C04B 2237/127 (2013.01); C04B 2237/34 (2013.01); C04B 2237/343 (2013.01); C04B 2237/348 (2013.01); C04B 2237/36 (2013.01); C04B 2237/365 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/592 (2013.01); C04B 2237/61 (2013.01); C04B 2237/64 (2013.01); C04B 2237/66 (2013.01); C04B 2237/68 (2013.01); C04B 2237/704 (2013.01); C04B 2237/708 (2013.01); C04B 2237/72 (2013.01); C04B 2237/76 (2013.01); C04B 2237/765 (2013.01); C04B 2237/80 (2013.01); C04B 2237/84 (2013.01); Y10T 403/46 (2015.01); Y10T 428/31504 (2015.04); Y10T 428/31678 (2015.04);
Abstract

An electrostatic chuck includes a ceramic top plate layer made of a beryllium oxide material, a ceramic bottom plate layer made of a beryllium oxide material, a ceramic middle plate layer disposed between the ceramic top plate layer and the ceramic bottom plate layer, an electrode layer disposed between the ceramic top plate layer and the ceramic middle plate layer, and a heater layer disposed between the ceramic middle plate layer and the ceramic bottom plate layer. The electrode layer joins and hermetically seals the ceramic top plate layer to the ceramic middle plate layer, and the heater layer joins and hermetically seals the ceramic middle plate layer to the ceramic bottom plate layer.

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