The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2026

Filed:

Jul. 19, 2023
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Wen-Jen Wang, Tainan, TW;

Yu-Huan Yeh, Hsinchu, TW;

Chuan-Fu Wang, Miaoli County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10N 70/00 (2023.01); H10B 63/00 (2023.01); H10N 70/20 (2023.01);
U.S. Cl.
CPC ...
H10N 70/8265 (2023.02); H10B 63/80 (2023.02); H10N 70/011 (2023.02); H10N 70/24 (2023.02); H10N 70/8833 (2023.02);
Abstract

An RRAM includes a bottom electrode, a resistive switching layer, a top electrode and a cap layer stacked from bottom to top. The cap layer includes a top surface. A first spacer contacts a first sidewall of the bottom electrode, and a second sidewall of the resistive switching layer. A second spacer contacts the first spacer and contacts a third spacer of the top electrode. A thickness of the first spacer is greater of a thickness of the second spacer. The first spacer and the second spacer do not cover the topmost surface of the cap layer.


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