The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2026
Filed:
Jul. 19, 2022
Applicant:
Semes Co., Ltd., Cheonan-si, KR;
Inventors:
Young Je Um, Busan, KR;
Wan Jae Park, Hwaseong-si, KR;
Dong-Hun Kim, Seoul, KR;
Seong Gil Lee, Hwaseong-si, KR;
Ji Hoon Park, Suwon-si, KR;
Assignee:
SEMES CO., LTD., Chungcheongnam-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3244 (2013.01); H01J 37/32422 (2013.01); H01J 37/32568 (2013.01); H01L 21/6833 (2013.01);
Abstract
The inventive concept provides a substrate treating method. The substrate treating method for treating a substrate at which thin films are stacked and a hole is formed thereon including treating the substrate using a first plasma including an ion, which is a first treating step; and treating the substrate using a second plasma removed of an ion, which is a second treating step.