The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Jun. 24, 2022
Packages with backside mounted die and exposed die interconnects and methods of fabricating the same
Applicant:
Wolfspeed, Inc., Durham, NC (US);
Inventors:
Michael Devita, Mesa, AZ (US);
Qianli Mu, San Jose, CA (US);
Assignee:
Wolfspeed, Inc., Durham, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 24/20 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6655 (2013.01);
Abstract
A method of fabricating a semiconductor device includes forming a protective structure on at least one die on a substrate. The protective structure exposes one or more electrical contacts on a first surface of the at least one die. Respective terminals are formed on the one or more electrical contacts exposed by the protective structure. Related packages and fabrication methods are also discussed.
Devita, Michael. (2026). Packages with backside mounted die and exposed die interconnects and methods of fabricating the same (U.S. Patent No. 12550744). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12550744
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile