The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Dec. 08, 2023
Applied Materials, Inc., Santa Clara, CA (US);
Qintao Zhang, Mt Kisco, NY (US);
Ludovico Megalini, Mountain View, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
Embodiments herein are directed to localized wafer thickness correction. In some embodiments, a method may include providing a substrate including an upper surface having a raised portion extending above a plane defined by the upper surface, and a non-raised portion adjacent the raised portion. The method may further include performing a metrology scan of the upper surface to determine a first dimension of the raised portion and a second dimension of the non-raised portion, and depositing a hardmask over the upper surface, including over the raised portion and the non-raised portion. The method may further include directing ions to the hardmask, wherein a first dose of the ions over the raised portion is greater than a second dose of the ions over the non-raised portion, and performing a first etch to the hardmask to remove the hardmask over the raised portion, wherein the hardmask remains over the non-raised portion.