The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Dec. 23, 2021
Applicants:

Soitec, Bernin, FR;

Applied Materials Inc., Santa Clara, CA (US);

Inventors:

Oleg Kononchuk, Bernin, FR;

Christophe Maleville, Bernin, FR;

Isabelle Bertrand, Bernin, FR;

Youngpil Kim, Bernin, FR;

Chee Hoe Wong, Bernin, FR;

Assignees:

Soitec, Bernin, FR;

Applied Materials Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/322 (2006.01); H01L 21/762 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02381 (2013.01); H01L 21/02532 (2013.01); H01L 21/3225 (2013.01); H01L 21/76254 (2013.01); H01L 23/66 (2013.01);
Abstract

A support substrate for a radiofrequency application comprises: —a base substrate made of monocrystalline silicon comprising P-type dopants and having a resistivity that is greater than or equal to 250 ohm·cm and strictly less than 500 ohm·cm, and a content of interstitial oxygen between 13 ppma and 19 ppma, —an epitaxial layer made of monocrystalline silicon comprising P-type dopants, disposed on the base substrate and having a thickness between 2 microns and 30 microns, an upper portion at least of the epitaxial layer having a resistivity greater than 3000 ohm·cm, —a charge-trapping layer made of polycrystalline silicon having a resistivity greater than or equal to 1000 ohm·cm and a thickness between 1 micron and 10 microns. A method is used for manufacturing such a support substrate.


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