The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Sep. 06, 2022
Applicants:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;

Inventors:

Yoko Iwakaji, Tokyo, JP;

Tomoko Matsudai, Tokyo, JP;

Ryohei Gejo, Kawasaki Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03K 17/567 (2006.01); H10D 12/00 (2025.01); H10D 62/10 (2025.01); H10D 62/17 (2025.01);
U.S. Cl.
CPC ...
H10D 12/481 (2025.01); H03K 17/567 (2013.01); H10D 62/109 (2025.01); H10D 62/127 (2025.01); H10D 62/393 (2025.01);
Abstract

A semiconductor device according to an embodiment includes a first trench, a first gate electrode in the first trench, a second trench, a second gate electrode provided in the second trench, a third trench, a third gate electrode in the third trench, a first electrode pad electrically connected to the first gate electrode, a second electrode pad electrically connected to the second gate electrode, and a third electrode pad electrically connected to the third gate electrode, in which a thickness of a conductive semiconductor region opposed to the third gate electrode is smaller than a thickness of a conductive semiconductor region opposed to the first gate electrode, and in which the thickness of the conductive semiconductor region opposed to the third gate electrode is smaller than a thickness of a conductive type semiconductor region opposed to the second gate electrode.


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