The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Aug. 27, 2018
Applicant:
Konica Minolta, Inc., Tokyo, JP;
Inventors:
Assignee:
KONICA MINOLTA, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/12 (2006.01); C09D 11/52 (2014.01); H01B 1/14 (2006.01); H01B 13/00 (2006.01); H05K 1/09 (2006.01); H05K 13/00 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 3/125 (2013.01); C09D 11/52 (2013.01); H01B 1/14 (2013.01); H01B 13/0036 (2013.01); H05K 1/092 (2013.01); H05K 1/097 (2013.01); H05K 3/10 (2013.01); H05K 2203/013 (2013.01);
Abstract
In a method for forming a conductive thin wire on a base material by an inkjet method using a conductive ink containing at least a main solvent having a boiling point equal to or lower than the boiling point of water, a solvent having a boiling point higher than that of water, and a conductive material, the base material has surface energy of less than 40 mN/m, and conditions of 30°≤θ1≤70°, 0°≤θ2≤40°, and θ2<θ1 are satisfied when a forward contact angle of the conductive ink to the base material is represented by θ1, and a backward contact angle of the conductive ink to the base material is represented by θ2.