The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Feb. 26, 2021
Applicant:
Tdk Electronics Ag, Munich, DE;
Inventors:
Bettina Milke, Berlin, DE;
Erkan Eser, Berlin, DE;
Assignee:
TDK Electronics AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); B23K 1/00 (2006.01); B23K 1/005 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); B23K 1/0008 (2013.01); B23K 1/0056 (2013.01); B23K 2101/42 (2018.08); H05K 2201/10151 (2013.01); H05K 2203/107 (2013.01);
Abstract
A solder connection that connects a contact pad on a first surface to a strip-shaped conductor. The strip-shaped conductor has a widening at one end and a through opening therein. A solder ball is located in the opening and connects the end of the conductor to the contact pad.
Quick Actions:
Milke, Bettina. (2026). Electrical solder connection, sensor with a solder connection and method of manufacture (U.S. Patent No. 12550258). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12550258
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile