The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2026
Filed:
Jan. 10, 2023
Applicant:
Unimicron Technology Corp., Taoyuan, TW;
Inventor:
Chun Hung Kuo, Taoyuan, TW;
Assignee:
UNIMICRON TECHNOLOGY CORP., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0204 (2013.01); H05K 1/024 (2013.01); H05K 3/4673 (2013.01); H05K 3/4679 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/0379 (2013.01); H05K 2203/0415 (2013.01);
Abstract
A circuit board structure includes a build-up structure, a graphene layer disposed on the build-up structure, and at least one conductive pillar disposed on the graphene layer, the graphene layer includes an oxidized area not covered by the at least one conductive pillar and a non-oxidized area covered by the at least one conductive pillar, and the at least one conductive pillar is electrically connected to the build-up structure via the non-oxidized area.
Quick Actions:
Kuo, Chun. (2026). Circuit board structure and manufacturing method thereof (U.S. Patent No. 12550246). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12550246
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile