The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2026

Filed:

Dec. 15, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Kristof Kuwawi Darmawikarta, Chandler, AZ (US);

Benjamin T. Duong, Phoenix, AZ (US);

Srinivas V. Pietambaram, Chandler, AZ (US);

Tarek A. Ibrahim, Mesa, AZ (US);

Ala Omer, Phoenix, AZ (US);

Bai Nie, Chandler, AZ (US);

Hari Mahalingam, Fremont, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/42 (2006.01); G02B 6/43 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4212 (2013.01); G02B 6/4239 (2013.01); G02B 6/43 (2013.01);
Abstract

Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include an integrated circuit (IC) in a first layer, wherein the first layer includes a substrate having a first surface, an opposing second surface, and a lateral surface substantially perpendicular to the first and second surfaces, wherein the substrate includes a waveguide between the first and second surfaces, and wherein and the IC is nested in a cavity in the substrate; a PIC in a second layer, wherein the second layer is on the first layer and an active surface of the PIC faces the first layer, and wherein the IC is electrically coupled to the active side of the PIC; and an optical component optically coupled to the active surface of the PIC and the waveguide in the substrate at the second surface.


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