The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2026

Filed:

Nov. 21, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Jianming Fu, Palo Alto, CA (US);

Tza-Jing Gung, San Jose, CA (US);

Sanjeev Baluja, Campbell, CA (US);

Haitao Wang, Santa Clara, CA (US);

Mandyam Sriram, San Jose, CA (US);

Srinivas Gandikota, Santa Clara, CA (US);

Steven V. Sansoni, Livermore, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); C23C 16/455 (2006.01); C23C 16/509 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3211 (2013.01); C23C 16/45536 (2013.01); C23C 16/45544 (2013.01); C23C 16/509 (2013.01); H01J 37/32715 (2013.01); H01J 2237/332 (2013.01);
Abstract

Embodiments of the disclosure are directed to PEALD batch processing chambers. Some embodiments are directed to processing chambers having one or more inductively coupled plasma (ICP) coils electrically connected to at least one RF power source. Some embodiments are directed to processing chambers having a wafer cassette comprising a plurality of platforms, each platform configured to support at least one wafer for processing, and one or more RF power sources electrically connected to the plurality of platforms in the wafer cassette. In some embodiments, the plurality of platforms have a first set of electrodes having a first polarity and a second set of electrodes having a second polarity, and one or more RF power sources electrically connected to the plurality of platforms in the wafer cassette.


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