The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Jun. 25, 2021
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Kristof Darmawikarta, Chandler, AZ (US);
Xiao Di Sun Zhou, Tempe, AZ (US);
Tarek A. Ibrahim, Mesa, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
G02B 6/4256 (2013.01); G02B 6/4204 (2013.01); H01L 23/3672 (2013.01); H01L 24/16 (2013.01); H01L 25/167 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01);
Abstract
Embodiments described herein may be related to apparatuses, processes, and techniques related to creating deep cavities within a substrate or at an edge of the substrate, by etching a cavity in the substrate to a first copper stop layer, removing the first copper stop layer, and then etching deeper into the cavity to a second copper stop layer. In embodiments this process may be repeated until the desired cavity depth is reached. Other embodiments may be described and/or claimed.