The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2026

Filed:

May. 07, 2025
Applicant:

Advantest Test Solutions, Inc., San Jose, CA (US);

Inventors:

Samer Kabbani, San Jose, CA (US);

Paul Ferrari, San Jose, CA (US);

Ikeda Hiroki, San Jose, CA (US);

Kiyokawa Toshiyuki, San Jose, CA (US);

Gregory Cruzan, San Jose, CA (US);

Karthik Ranganathan, San Jose, CA (US);

Assignee:

Advantest Test Solutions, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 31/3185 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2887 (2013.01); G01R 31/318511 (2013.01); H01L 23/473 (2013.01); F28F 2260/02 (2013.01);
Abstract

A system for testing circuits of an integrated circuit semiconductor wafer includes a thermal interposer (TI) device for use in testing circuits of a semiconductor device. The TI device includes a top surface configured to receive the semiconductor device, a heating layer defining a plurality of independently controllable thermal zones configured to maintain or change temperatures of the top surface during the testing, a power input configured to receive electrical power and wherein the electrical power is configured to be selectively applied to one or more of the plurality of independently controllable thermal zones, and an electromagnetic interference (EMI) shield layer defining the top surface and disposed to shield the top surface from EMI from the heating layer.


Find Patent Forward Citations

Kabbani, Samer. (2026). Wafer scale active thermal interposer for device testing (U.S. Patent No. 12540968). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12540968

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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