The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Jun. 23, 2023
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); C08K 3/36 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08J 5/244 (2021.05); C08J 5/248 (2021.05); C08K 3/36 (2013.01); H05K 1/0366 (2013.01); C08J 2327/18 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); H05K 2201/015 (2013.01); H05K 2201/029 (2013.01);
Abstract
A fluoroplastic substrate for high-speed communications has a dielectric loss tangent at 40 GHz of from 0.0001 to 0.0008 and a permittivity at 40 GHz of from 2.0 to 3.2. The substrate includes a quartz glass cloth having a dielectric loss tangent at 40 GHz of from 0.0001 to 0.0008 and a fluoroplastic having a dielectric loss tangent at 40 GHz of from 0.0001 to 0.0005.
Shiobara, Toshio. (2026). Fluoroplastic substrate for high-speed communications and copper-clad fluoroplastic substrate for high-speed communications (U.S. Patent No. 12540222). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12540222
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile