The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

Dec. 30, 2022
Applicant:

Hangzhou Silicon-magic Semiconductor Technology Co., Ltd., Zhejiang, CN;

Inventors:

Xiao Yang, Hangzhou, CN;

Hui Chen, Hangzhou, CN;

Jiakun Wang, Hangzhou, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 84/00 (2025.01); H01L 21/04 (2006.01); H01L 21/3205 (2006.01); H01L 21/3213 (2006.01); H01L 21/768 (2006.01); H10D 8/01 (2025.01); H10D 30/01 (2025.01); H10D 30/66 (2025.01); H10D 62/13 (2025.01); H10D 62/17 (2025.01);
U.S. Cl.
CPC ...
H10D 84/146 (2025.01); H01L 21/046 (2013.01); H01L 21/32051 (2013.01); H01L 21/32133 (2013.01); H01L 21/76877 (2013.01); H10D 8/051 (2025.01); H10D 30/023 (2025.01); H10D 30/0291 (2025.01); H10D 30/668 (2025.01); H10D 62/154 (2025.01); H10D 62/158 (2025.01); H10D 62/235 (2025.01);
Abstract

Disclosed is a trench-type power device and a manufacturing method thereof. The trench-type power device comprises: a semiconductor substrate; a drift region located on the semiconductor substrate; a first trench and a second trench located in the drift region; a gate stack located in the first trench; and Schottky metal located on a side wall of the second trench, wherein the Schottky metal and the drift region form a Schottky barrier diode. The trench-type power device adopts a double-trench structure, which combines a trench-type MOSFET with the Schottky barrier diode and forms the Schottky metal on the side wall of the trench, so that the performance of the power device can be improved, and the unit area of the power device can be reduced.


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