The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2026
Filed:
Dec. 02, 2020
Intel Corporation, Santa Clara, CA (US);
Timothy Glen Hanna, Tigard, OR (US);
Suchismita Sarangi, Hillsboro, OR (US);
Carl D. Williams, Hillsboro, OR (US);
Jordan Johnson, Albany, OR (US);
Juan G. Cevallos Palomeque, Portland, OR (US);
Mark E. Sprenger, Tigard, OR (US);
Peipei Ding, Taipei, TW;
Christian Amoah-Kusi, Portland, OR (US);
Sean T. Sivapalan, Portland, OR (US);
Rithi S. Soeung, Hillsboro, OR (US);
Curtis A. Valentine, Scappoose, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An apparatus is described. The apparatus includes a cold plate. The ruler factor cold plate is to receive heat from semiconductor chips of a electronic component that is to be plugged into an electronic system. The cold plate has at least one of: a) a linearly advancing physical interface, the linearly advancing physical interface to make physical contact with a corresponding linearly advancing physical interface of a cooling component of the electronic system, the physical contact to create a thermal path from the cold plate to the cooling component; b) first fingers on a first face of the cold plate to make spring-force thermal contact with the semiconductor chips of the electronic component and second fingers on an opposite second face of the cold plate to make spring-force thermal contact with the respective semiconductor chips of another, neighboring electronic component.