The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2026

Filed:

Dec. 15, 2022
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jeremy R. Fox, Georgetown, TX (US);

Martin G. Keen, Cary, NC (US);

Alexander Reznicek, Troy, NY (US);

Bahman Hekmatshoartabari, White Plains, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/4099 (2006.01);
U.S. Cl.
CPC ...
G05B 19/4099 (2013.01); G05B 2219/49023 (2013.01);
Abstract

A method, computer program, and computer system are provided for enabling chip-infused filament for 3D printing. A structure to be formed through 3D printing is identified. A type associated with one or more sensors embedded in a polymer filament and a location are determined for the one or more sensors within the structure. The structure may then be 3D printed with the one or more sensors at the location based on using the polymer filament at the location within the structure.


Find Patent Forward Citations

Fox, Jeremy. (2026). Embedded sensor chips in 3d and 4d printed structures through selective filament infusion (U.S. Patent No. 12535796). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12535796

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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