The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Jul. 13, 2022
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Xia Li, San Diego, CA (US);

Bin Yang, San Diego, CA (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 25/07 (2006.01); H01L 23/00 (2006.01); H10D 30/67 (2025.01); H10D 62/40 (2025.01);
U.S. Cl.
CPC ...
H01L 25/074 (2013.01); H01L 25/50 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80896 (2013.01); H01L 2924/13069 (2013.01); H10D 30/6735 (2025.01); H10D 30/6757 (2025.01); H10D 62/40 (2025.01);
Abstract

A stacked gate-all-around (GAA) complementary field-effect transistor (CFET) includes a first GAA FET of a first type and a second GAA FET of a second type. Each of the first GAA FET and the second GAA FET includes at least one three-dimensional (3D) semiconductor slab with a channel region and a first surface. A first gate structure surrounds the channel region in the first GAA FET, and a second gate structure surrounds the channel region in the second GAA FET. The first gate structure is stacked opposite the second gate structure in a direction orthogonal to the first surface. In some examples, a first crystal structure of the 3D semiconductor slab in the first GAA FET has a first orientation, and a second crystal structure of the 3D semiconductor slab in the second GAA FET has a different orientation for improved carrier mobility.


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