The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Jul. 18, 2022
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Yung-Ta Li, Taichung, TW;
PO-Kai Huang, Taichung, TW;
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung, TW;
Abstract
An electronic package is provided in which an electronic structure is bonded onto a carrier structure via a plurality of conductive elements, where each of the conductive elements is connected to a single contact of the electronic structure via a plurality of conductive pillars. Therefore, when one of the conductive pillars fails, each of the conductive elements can still be electrically connected to the contact via the other of the conductive pillars to increase electrical conductivity.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile