The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Dec. 08, 2022
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Hui-Chi Tang, Hsinchu, TW;
Shao-Chun Ho, Hsinchu, TW;
Hsuan-Yi Lin, Hsinchu, TW;
Pu-Shan Huang, Hsinchu, TW;
Assignee:
MEDIATEK INC., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/49811 (2013.01); H01L 24/32 (2013.01); H01L 2224/32225 (2013.01);
Abstract
A board-level pad pattern includes a corner pad unit disposed at a corner of a surface mount region for mounting a multi-row QFN package. The corner pad unit includes at least a reversed-L-shaped pad. The reversed-L-shaped pad is disposed in proximity to an apex of the corner of the surface mount region.