The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Mar. 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Kao-Chih Liu, Changhua County, TW;
Wenmin Hsu, Hsinchu, TW;
Hsuan Jung Chiu, Taichung, TW;
Yu-Ting Lin, Hsin-Chu, TW;
Chia Hong Lin, Hsinchu County, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A semiconductor substrate includes a plurality of transistors. A first structure is disposed over a first side of the semiconductor substrate. The first structure contains a plurality of first metallization components. A carrier substrate is disposed over the first structure. The first structure is located between the carrier substrate and the semiconductor substrate. One or more openings extend through the carrier substrate and expose one or more regions of the first structure to the first side. A second structure is disposed over a second side of the semiconductor substrate opposite the first side. The second structure contains a plurality of second metallization components.