The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Feb. 08, 2021
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Sivananda Krishnan Kanakasabapathy, Pleasanton, CA (US);

Akhil Singhal, Beaverton, OR (US);

Alan J. Jensen, Mountain House, CA (US);

Seongjun Heo, Dublin, CA (US);

Nishat Hasan, Portland, OR (US);

Srividya Revuru, West Linn, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0234 (2013.01); H01L 21/02052 (2013.01); H01L 21/311 (2013.01); H01L 22/12 (2013.01);
Abstract

Methods, apparatus, and systems are provided herein for processing a substrate. Generally, the processing involves Spacer-on-Spacer (SoS) Self-Aligned Quadruple Patterning (SAQP) techniques. The disclosed techniques provide a novel process flow that reduces defects by ensuring that cores are not removed from the substrate until the substrate is transferred to a deposition chamber used to deposit a second spacer layer. This reduces or eliminates the risk of structural damage to features on the substrate while the substrate is being transferred or cleaned. Such structural damage is common when the cores are removed from the substrate prior to cleaning and transfer.


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