The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Jun. 13, 2022
Shinko Electric Industries Co., Ltd., Nagano, JP;
Masao Kainuma, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A header for a semiconductor package, includes an eyelet having a through hole penetrating the eyelet from an upper surface to a lower surface of the eyelet, a first lead inserted inside the through hole, and an insulating substrate disposed on the upper surface of the eyelet, and provided with a first through hole at a position overlapping one end of the first lead in a plan view. The insulating substrate has a thermal conductivity lower than a thermal conductivity of the first lead. A first conductive layer is formed on an inner wall defining the first through hole, and the first conductive layer extends to an upper surface of the insulating substrate. The one end of the first lead is electrically connected to the first conductive layer, and a space is provided above the one end of the first lead inside the first through hole.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile