The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Jun. 14, 2022
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Shinichiro Miyahara, Kariya, JP;

Shoji Mizuno, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 30/66 (2025.01); H10D 12/01 (2025.01); H10D 62/10 (2025.01); H10D 62/17 (2025.01); H10D 62/832 (2025.01); H10D 89/60 (2025.01);
U.S. Cl.
CPC ...
H10D 30/668 (2025.01); H10D 12/031 (2025.01); H10D 62/127 (2025.01); H10D 62/393 (2025.01); H10D 62/8325 (2025.01); H10D 89/611 (2025.01);
Abstract

A silicon carbide semiconductor device includes a substrate, a drift layer, a base layer, a first electrode, and a second electrode. The substrate includes a cell region at which a semiconductor element is disposed and a temperature detection region at which a diode element is disposed. The first electrode is disposed at a side facing the substrate with the drift layer sandwiched between the substrate and the first electrode. The second electrode is disposed at a side facing the drift layer with the substrate sandwiched between the drift layer and the second electrode. The semiconductor element includes a first impurity region and a second impurity region disposed at a surface layer portion of the base layer. The diode element includes a first constituent layer at a surface layer portion of the base layer and a second constituent layer connected to the first constituent layer.


Find Patent Forward Citations

Miyahara, Shinichiro. (2026). Silicon carbide semiconductor device (U.S. Patent No. 12532503). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12532503

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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