The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Jan. 17, 2023
Applicant:

Vanguard International Semiconductor Corporation, Hsinchu, TW;

Inventors:

Shin-Cheng Lin, Hsinchu County, TW;

Chia-Ching Huang, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 30/47 (2025.01); H10D 30/01 (2025.01); H10D 64/01 (2025.01); H10D 64/23 (2025.01); H10D 64/27 (2025.01);
U.S. Cl.
CPC ...
H10D 30/475 (2025.01); H10D 30/015 (2025.01); H10D 64/01 (2025.01); H10D 64/258 (2025.01); H10D 64/411 (2025.01);
Abstract

A high electron mobility transistor structure includes a compound semiconductor channel layer disposed on a substrate, a compound semiconductor barrier layer disposed on the compound semiconductor channel layer, and a compound semiconductor cap layer disposed on the compound semiconductor barrier layer. The compound semiconductor cap layer includes a first segment and a second segment arranged along a first direction, and a gap between the first segment and the second segment. A gate electrode is disposed on the compound semiconductor cap layer. A source electrode and a drain electrode are disposed on the compound semiconductor barrier layer, arranged along a second direction and respectively located on two sides of the compound semiconductor cap layer.


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