The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2026
Filed:
Aug. 15, 2023
Applicant:
United Microelectronics Corp., Hsin-Chu, TW;
Inventors:
Da-Jun Lin, Kaohsiung, TW;
Bin-Siang Tsai, Changhua County, TW;
Fu-Yu Tsai, Tainan, TW;
Chung-Yi Chiu, Tainan, TW;
Assignee:
UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 1/68 (2025.01);
U.S. Cl.
CPC ...
H10D 1/684 (2025.01); H10D 1/692 (2025.01);
Abstract
A metal-insulator-metal capacitor includes a bottom electrode, a dielectric layer, a superlattice layer, a silicon dioxide layer and a top electrode stacked from bottom to top. The superlattice layer contacts the dielectric layer. A silicon dioxide layer has a negative voltage coefficient of capacitance.